News

Glue-On Board for Fine Pitch SMD LED display.

People may know few things about COB LED display, but probably didn’t hear the new pixel protection technology, GOB LED display. Let’s introduce for you now.

What’s GOB LED Display?

GOB is Glue on board to get high protection led display, which is new technology, an analogy as module encapsulation. It is working on the whole display module, e.g. 250*250mm, by using a patented transparent glue covering the surface of module’s PCB board already with thousands SMD lamps soldered on it, finally the module getting the special shield on its surface.

It comes out a high protection led display capable for anti-collision (anti-bump), dust-proof, waterproof, anti-moisture, anti-UV, along with no harmful impact for heat dissipation and brightness loss. The long time strict test clarified that the shield-glue even contributes the heat dissipation, extending the life span.

The revolution change to push the whole led display industry is that this GOB display is aimed for the fine pitch led display and rental screens, which have natural demands for led diodes protection.

Whether GOB can be called packaging technology?

As we all know, the three major packaging technologies of DIP, SMD, and COB so far all involve LED chip-level technology. However, GOB does not involve the protection of LED chips, but a protective process for protecting the PIN feet of the bracket of SMD devices on the SMD module. If you want to call it a technology, it can only be regarded as a module-level protection technology.

The GOB process is only a glue protection treatment process for the surface of the display panel in the downstream of the traditional industrial chain (display screen manufacturers ), and it is a process that can only be carried out after the SMT process is completed.